The Effect of Using Pumice Powder and Plasticizer on Physico-Mechanical and Thermal Properties of Cement-Bonded Particleboards

In this study, the effect of using pumice powder and plasticizer on some properties of cement bonded particleboards (CBPBs) was investigated. Therefore, CBPBs were produced using 0 %, 10 %, 20 % and 30 % pumice powder and 0 %, 0.4 %, 0.8 %, 1.2% plasticizer. Based on test results, it was found that using pumice powder had an important positive effect on water absorption and thickness swelling, but no effect on density. The amount of thickness swelling decreased by 15 % with the use of 30 % pumice powder. The modulus of elasticity and internal bond strength were generally increased by 20 % with the use of pumice powder, while modulus of rupture and thermal insulation properties were decreased. The use of 0.4 % and 0.8 % plasticizers positively affected the properties of board properties. The use of plasticizer had a positive effect on thermal properties. The thermal conductivity values decreased by 18 % as the amount of plasticizer increased to 1.2 %. In this regard, the use of plasticizers in CBPBs production is an option in terms of improving thermal properties.